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Precision Micro-Machined Critical Components for Advanced Semiconductor Packaging
In today's high-precision semiconductor world the quality of packaging directly determines the ultimate performance, reliability and lifespan of the chip. As a leading provider of precision machining solutions, we focus on manufacturing core structural components and load-bearing parts that are indispensable in semiconductor packaging and testing equipment. We deeply understand your ultimate pursuit of macroscopic dimensions and microscopic positional tolerances.
The core components we specialize in :
We excel in manufacturing components that have strict requirements for dimensional stability, flatness and positioning accuracy, such as:
1.Precision heat dissipation substrate and heat sink: Provide an absolutely flat contact interface for efficient heat dissipation.
2.Precision platform and load-bearing plate for equipment: It is used as a reference platform for chip mounting and testing.
3.The core template and pad of the packaging mold: Ensure that the mold maintains extremely high alignment accuracy during long-term operation.
Core features and requirements :
The machining of semiconductor packaging components is different from ordinary mechanical processing and has extremely high requirements
1.Dimensions: 330*280*2.8
2.Extremely high precision and tolerance
(1) Dimensional tolerances are usually required to be within ±0.002mm or even stricter.
(2)The shape and position tolerances such as true roundness and flatness also reach the micrometer level.
3.Ultimate flatness and parallelism:Achieve a double-sided flatness of 0.015mm and a parallelism of 0.015mm to ensure that the components do not warp or experience stress during high-speed operation, providing a stable and reliable reference plane.
4.Core technology: Precision CNC milling
(1)High-speed machining centers are used for 3-axis, 4-axis or 5-axis linkage processing to handle complex curved surfaces.
(2)Micro-milling technology is adopted, and micro-tools with diameters less than 1mm or even 0.1mm are used to process fine structures.
5.Outstanding stability and long service life:Packaging production is a continuous operation of 7x24 hours. The mold components must be able to withstand millions or even hundreds of millions of cycles without maintaining their accuracy. Therefore, there are extremely high requirements for the uniformity of materials and the control of processing residual stress.
6.Measurement and Detection:A wide range of equipment such as three-coordinate measuring machines, optical image measuring instruments, profilometers and white light interferometers are widely used to conduct full-size and surface roughness inspections on processed components to ensure 100% compliance with design requirements.
Our technological cornerstone:
1.Materials science expert: Proficient in the processing characteristics of various aluminum alloys, stainless steels, steels and engineering plastics, capable of optimizing processes in a targeted manner to ensure long-term dimensional stability.
2.Full-process quality control: Utilizing three-coordinate measuring machines, laser trackers, and high-precision plane interferometers, 100% data tracking is conducted for every stage from raw materials to finished products to ensure "zero-defect" delivery.
Why did you choose us:
Choosing us means you have chosen a reliable partner who can overcome the challenges of complex tolerances. We are not only suppliers of components, but also your technical support for improving packaging yield, optimizing production efficiency and reducing total costs.
If you are looking for a machining partner that can achieve such ±0.01mm positioning accuracy and 0.015mm global flatness, please contact us immediately. Our engineering team is all set to safeguard your next-generation semiconductor products.
Precision Micro-Machined Critical Components for Advanced Semiconductor Packaging
In today's high-precision semiconductor world the quality of packaging directly determines the ultimate performance, reliability and lifespan of the chip. As a leading provider of precision machining solutions, we focus on manufacturing core structural components and load-bearing parts that are indispensable in semiconductor packaging and testing equipment. We deeply understand your ultimate pursuit of macroscopic dimensions and microscopic positional tolerances.
The core components we specialize in :
We excel in manufacturing components that have strict requirements for dimensional stability, flatness and positioning accuracy, such as:
1.Precision heat dissipation substrate and heat sink: Provide an absolutely flat contact interface for efficient heat dissipation.
2.Precision platform and load-bearing plate for equipment: It is used as a reference platform for chip mounting and testing.
3.The core template and pad of the packaging mold: Ensure that the mold maintains extremely high alignment accuracy during long-term operation.
Core features and requirements :
The machining of semiconductor packaging components is different from ordinary mechanical processing and has extremely high requirements
1.Dimensions: 330*280*2.8
2.Extremely high precision and tolerance
(1) Dimensional tolerances are usually required to be within ±0.002mm or even stricter.
(2)The shape and position tolerances such as true roundness and flatness also reach the micrometer level.
3.Ultimate flatness and parallelism:Achieve a double-sided flatness of 0.015mm and a parallelism of 0.015mm to ensure that the components do not warp or experience stress during high-speed operation, providing a stable and reliable reference plane.
4.Core technology: Precision CNC milling
(1)High-speed machining centers are used for 3-axis, 4-axis or 5-axis linkage processing to handle complex curved surfaces.
(2)Micro-milling technology is adopted, and micro-tools with diameters less than 1mm or even 0.1mm are used to process fine structures.
5.Outstanding stability and long service life:Packaging production is a continuous operation of 7x24 hours. The mold components must be able to withstand millions or even hundreds of millions of cycles without maintaining their accuracy. Therefore, there are extremely high requirements for the uniformity of materials and the control of processing residual stress.
6.Measurement and Detection:A wide range of equipment such as three-coordinate measuring machines, optical image measuring instruments, profilometers and white light interferometers are widely used to conduct full-size and surface roughness inspections on processed components to ensure 100% compliance with design requirements.
Our technological cornerstone:
1.Materials science expert: Proficient in the processing characteristics of various aluminum alloys, stainless steels, steels and engineering plastics, capable of optimizing processes in a targeted manner to ensure long-term dimensional stability.
2.Full-process quality control: Utilizing three-coordinate measuring machines, laser trackers, and high-precision plane interferometers, 100% data tracking is conducted for every stage from raw materials to finished products to ensure "zero-defect" delivery.
Why did you choose us:
Choosing us means you have chosen a reliable partner who can overcome the challenges of complex tolerances. We are not only suppliers of components, but also your technical support for improving packaging yield, optimizing production efficiency and reducing total costs.
If you are looking for a machining partner that can achieve such ±0.01mm positioning accuracy and 0.015mm global flatness, please contact us immediately. Our engineering team is all set to safeguard your next-generation semiconductor products.
