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Precision PCB Welding Fixture for University Data Acquisition and Pressure Temperature Test Equipment
Header include
The pressure and temperature tester circuit board soldering fixture is a high-precision auxiliary tooling specially developed for the research and experimental instrument industry in colleges and universities. This fixture, through a precise positioning and protection system, ensures that the precision circuit board for multi-sensor mixed measurement maintains accurate component relative positions and electrical connection reliability during the soldering process. It is the fundamental guarantee equipment for realizing the stable data acquisition function of experimental instruments.
Abject of manufacture
1.The main structure is composed of a multi-layer frame structure made of fiberglass epoxy resin board (FR-4) and anti-static bakelite.
2.Core components: It includes high-temperature silicone rubber pressure pads, corrosion-resistant spring probes, 304 stainless steel positioning columns and PTFE heat insulation carrier plates.
3.Compatible object: Specifically designed for hybrid circuit boards of pressure sensors (piezoresistive/capacitive) and thermocouple /RTD temperature acquisition modules.
Core features and requirements
1.Multi-level positioning accuracy: The accuracy of the main positioning pin is ±0.01mm, and the accuracy of the auxiliary positioning hole is ±0.02mm, ensuring the positional consistency of high-density mount components.
2.Welding thermal management characteristics: The substrate can withstand a temperature of ≥280℃, with a thermal deformation coefficient of ≤1.5×10⁻⁵/℃, and can continuously resist the high-temperature impact of wave soldering.
3.Signal integrity guarantee: The contact resistance of the test probe is ≤30mΩ, and the insulation resistance is ≥10¹²Ω, preventing interference attenuation during weak signal measurement.
4.Error-proofing and safety assurance: Equipped with polarity error-proofing design, grounding leakage alarm interface and static dissipation path (surface resistance 10⁶-10⁹Ω).
5.Adaptive bonding system: 16-point matrix pressure adjustable mechanism, pressure range 0.5-3.0N per point, suitable for sensitive components of different sizes.
Key processes and technologies
1.Composite substrate processing technology
(1)The combined process of CNC milling and laser cutting is adopted to ensure that the edges of the fiberglass material are free of burrs and chipping.
(2)The installation holes of the positioning elements are treated with copper sleeve inlaying technology, which increases the wear-resistant service life to over 500,000 times.
2.Thermal balance structure design
(1)The layout of the heat dissipation trough was optimized through thermal simulation analysis, and the temperature difference on the plate surface during the welding process was controlled within ±3℃.
(2)Nano-porous insulation layers are set in the key component areas, and the local temperature resistance is increased to 320℃.
3.Precision detection system integration
(1)The integrated three-wire detection path enables real-time monitoring of connectivity during the welding process.
(2)The floating contact design with spring probes is adopted to compensate for the PCB board thickness tolerance of ±0.15mm.
(3)The key signal channels are equipped with RF shielding structures to suppress high-frequency interference.
4.Traceable management system
(1)Establish an automatic fixture usage count device
(2)Implement a monthly verification system for positioning accuracy
(3)Manage different models of adapters through the color identification system
Conclusion
This welding fixture provides reliable process support for the university research and experimental instrument industry through the collaborative innovation of multi-level positioning technology, thermal management design and signal integrity protection. Its precise mechanical structure and electrical characteristics effectively ensure the accuracy and repeatability of the data collected by the pressure and temperature tester. It not only meets the extreme requirements for measurement precision in scientific research experiments but also adaptes to the durability demands frequently used in teaching demonstrations, thus becoming an important engineering and technical link connecting experimental design and data credibility.
Precision PCB Welding Fixture for University Data Acquisition and Pressure Temperature Test Equipment
Header include
The pressure and temperature tester circuit board soldering fixture is a high-precision auxiliary tooling specially developed for the research and experimental instrument industry in colleges and universities. This fixture, through a precise positioning and protection system, ensures that the precision circuit board for multi-sensor mixed measurement maintains accurate component relative positions and electrical connection reliability during the soldering process. It is the fundamental guarantee equipment for realizing the stable data acquisition function of experimental instruments.
Abject of manufacture
1.The main structure is composed of a multi-layer frame structure made of fiberglass epoxy resin board (FR-4) and anti-static bakelite.
2.Core components: It includes high-temperature silicone rubber pressure pads, corrosion-resistant spring probes, 304 stainless steel positioning columns and PTFE heat insulation carrier plates.
3.Compatible object: Specifically designed for hybrid circuit boards of pressure sensors (piezoresistive/capacitive) and thermocouple /RTD temperature acquisition modules.
Core features and requirements
1.Multi-level positioning accuracy: The accuracy of the main positioning pin is ±0.01mm, and the accuracy of the auxiliary positioning hole is ±0.02mm, ensuring the positional consistency of high-density mount components.
2.Welding thermal management characteristics: The substrate can withstand a temperature of ≥280℃, with a thermal deformation coefficient of ≤1.5×10⁻⁵/℃, and can continuously resist the high-temperature impact of wave soldering.
3.Signal integrity guarantee: The contact resistance of the test probe is ≤30mΩ, and the insulation resistance is ≥10¹²Ω, preventing interference attenuation during weak signal measurement.
4.Error-proofing and safety assurance: Equipped with polarity error-proofing design, grounding leakage alarm interface and static dissipation path (surface resistance 10⁶-10⁹Ω).
5.Adaptive bonding system: 16-point matrix pressure adjustable mechanism, pressure range 0.5-3.0N per point, suitable for sensitive components of different sizes.
Key processes and technologies
1.Composite substrate processing technology
(1)The combined process of CNC milling and laser cutting is adopted to ensure that the edges of the fiberglass material are free of burrs and chipping.
(2)The installation holes of the positioning elements are treated with copper sleeve inlaying technology, which increases the wear-resistant service life to over 500,000 times.
2.Thermal balance structure design
(1)The layout of the heat dissipation trough was optimized through thermal simulation analysis, and the temperature difference on the plate surface during the welding process was controlled within ±3℃.
(2)Nano-porous insulation layers are set in the key component areas, and the local temperature resistance is increased to 320℃.
3.Precision detection system integration
(1)The integrated three-wire detection path enables real-time monitoring of connectivity during the welding process.
(2)The floating contact design with spring probes is adopted to compensate for the PCB board thickness tolerance of ±0.15mm.
(3)The key signal channels are equipped with RF shielding structures to suppress high-frequency interference.
4.Traceable management system
(1)Establish an automatic fixture usage count device
(2)Implement a monthly verification system for positioning accuracy
(3)Manage different models of adapters through the color identification system
Conclusion
This welding fixture provides reliable process support for the university research and experimental instrument industry through the collaborative innovation of multi-level positioning technology, thermal management design and signal integrity protection. Its precise mechanical structure and electrical characteristics effectively ensure the accuracy and repeatability of the data collected by the pressure and temperature tester. It not only meets the extreme requirements for measurement precision in scientific research experiments but also adaptes to the durability demands frequently used in teaching demonstrations, thus becoming an important engineering and technical link connecting experimental design and data credibility.
