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Ultra-Pure PEEK Components, Semiconductor-Grade Wafer Handling & Fluidic Parts
Header include
This product is an ultra-high precision and ultra-high purity engineering plastic part specially designed and manufactured for semiconductor industrial equipment. It is made from the high-performance polyetheretherketone (PEEK) as the base material through precision processing technology implemented in a strictly controlled environment. Its core feature lies in the combination of the inherent excellent performance of PEEK material with an extremely high dimensional accuracy of ±0.005mm. To meet the extreme requirements of semiconductor manufacturing equipment for components in terms of cleanliness, stability and micro-scale control.
Abject of manufacture
1.Base material: PEEK (polyetheretherketone). This is a top-grade high-performance thermoplastic, which not only possesses mechanical strength close to that of metals, fatigue resistance and self-lubrication, but more importantly, its inherent high purity, low gas release, resistance to plasma erosion and excellent chemical resistance, enabling it to perfectly cope with the chemical solvents, high vacuum environments and various etching processes in the semiconductor manufacturing process.
2.Final form: Customized precision components. Common forms include but are not limited to wafer carriers (such as arms, grippers), vacuum cups, fluid valve seats, insulating pads, and sensor sheaths, etc.
3.Core indicator: The machining accuracy of key dimensions must be stably controlled within ±0.005mm.
Core features and requirements
1.Ultimate precision (±0.005mm) : This is the core value of this product. Micron-level tolerances ensure that parts can be assembled without gaps and precisely positioned in precision equipment, which is directly related to the accuracy of wafer transmission, the sealing of process chambers, and the yield rate of the entire production process.
2.Extraordinary cleanliness and low gas release: The parts must be free from any form of contamination. The entire manufacturing process must be carried out in a clean environment to ensure that the finished product is free of dust and metal ion residues. Moreover, in a vacuum environment, the material itself releases very few gas molecules to prevent contamination of the process chamber.
3.Outstanding physical and chemical stability: PEEK material can withstand the cleaning of common acids, alkalis and organic solvents in semiconductor equipment, and has good creep resistance. It can maintain the stability of size and shape under long-term vibration and load.
4.Functional requirements: Depending on the specific application, the parts may also need to have anti-static (ESD) properties or undergo special treatment to achieve an extremely low surface roughness to prevent particle adhesion
Key processes and technologies
The processing procedure to achieve the above requirements is a systematic project, involving all-round control of equipment, environment and technology
1.Precision CNC machining centers (CNC) and lathes
（1）Equipment requirements: Use multi-axis CNC machines and CNC lathes with high rigidity and high dynamic accuracy. Their own positioning accuracy and repeat positioning accuracy must be far higher than the ±0.005mm requirement
（2）Tool technology: Diamond or special hard alloy tools are adopted to ensure the sharpness and wear resistance of the cutting edge, achieving clean cutting of PEEK material and avoiding material melting due to overheating or the formation of stringing and burrs.
2.Full-process environmental control
（1）Cleanroom production: All fine processing and subsequent treatment must be carried out in a cleanroom of at least ISO Class 7 (10,000 grade) or higher, and the number of particles in the environment must be strictly controlled.
（2）Specialized fixtures and isolation: Non-metallic specialized fixtures are used, and the equipment for processing PEEK is physically isolated from that for processing metals to completely prevent cross-contamination.
3. Process and Quality management
（1）Scientific processing parameters: By adopting a strategy of small cutting depth, rapid feed, and thorough cooling (typically using high-purity compressed air or dedicated coolant), the cutting heat can be effectively controlled, and processing stress and deformation can be suppressed.
（2）Online measurement and constant temperature detection: Electronic micrometers and pneumatic measuring instruments with a resolution of 0.001mm are frequently used in the processing. All final tests must be carried out in a constant-temperature laboratory (20±1°C) using a coordinate measuring machine (CMM) to eliminate the influence of thermal expansion and contraction on the measurement results.
（3）Strict cleaning and packaging: After processing, the parts need to undergo multiple ultrasonic cleaning, plasma cleaning and other processes, and are sealed in vacuum anti-static packaging bags in a 100-level ultra-clean workbench.
Conclusion
This PEEK part for semiconductors is the result of cutting-edge materials science and ultra-precision manufacturing processes. By deeply integrating the inherent purity and stability of PEEK with the micron-level processing technology in harsh environments, it has successfully addressed the three core demands of semiconductor manufacturing equipment for core components in terms of precision, cleanliness and reliability, becoming a key support for ensuring high yield and high efficiency operation in chip manufacturing.
Ultra-Pure PEEK Components, Semiconductor-Grade Wafer Handling & Fluidic Parts
Header include
This product is an ultra-high precision and ultra-high purity engineering plastic part specially designed and manufactured for semiconductor industrial equipment. It is made from the high-performance polyetheretherketone (PEEK) as the base material through precision processing technology implemented in a strictly controlled environment. Its core feature lies in the combination of the inherent excellent performance of PEEK material with an extremely high dimensional accuracy of ±0.005mm. To meet the extreme requirements of semiconductor manufacturing equipment for components in terms of cleanliness, stability and micro-scale control.
Abject of manufacture
1.Base material: PEEK (polyetheretherketone). This is a top-grade high-performance thermoplastic, which not only possesses mechanical strength close to that of metals, fatigue resistance and self-lubrication, but more importantly, its inherent high purity, low gas release, resistance to plasma erosion and excellent chemical resistance, enabling it to perfectly cope with the chemical solvents, high vacuum environments and various etching processes in the semiconductor manufacturing process.
2.Final form: Customized precision components. Common forms include but are not limited to wafer carriers (such as arms, grippers), vacuum cups, fluid valve seats, insulating pads, and sensor sheaths, etc.
3.Core indicator: The machining accuracy of key dimensions must be stably controlled within ±0.005mm.
Core features and requirements
1.Ultimate precision (±0.005mm) : This is the core value of this product. Micron-level tolerances ensure that parts can be assembled without gaps and precisely positioned in precision equipment, which is directly related to the accuracy of wafer transmission, the sealing of process chambers, and the yield rate of the entire production process.
2.Extraordinary cleanliness and low gas release: The parts must be free from any form of contamination. The entire manufacturing process must be carried out in a clean environment to ensure that the finished product is free of dust and metal ion residues. Moreover, in a vacuum environment, the material itself releases very few gas molecules to prevent contamination of the process chamber.
3.Outstanding physical and chemical stability: PEEK material can withstand the cleaning of common acids, alkalis and organic solvents in semiconductor equipment, and has good creep resistance. It can maintain the stability of size and shape under long-term vibration and load.
4.Functional requirements: Depending on the specific application, the parts may also need to have anti-static (ESD) properties or undergo special treatment to achieve an extremely low surface roughness to prevent particle adhesion
Key processes and technologies
The processing procedure to achieve the above requirements is a systematic project, involving all-round control of equipment, environment and technology
1.Precision CNC machining centers (CNC) and lathes
（1）Equipment requirements: Use multi-axis CNC machines and CNC lathes with high rigidity and high dynamic accuracy. Their own positioning accuracy and repeat positioning accuracy must be far higher than the ±0.005mm requirement
（2）Tool technology: Diamond or special hard alloy tools are adopted to ensure the sharpness and wear resistance of the cutting edge, achieving clean cutting of PEEK material and avoiding material melting due to overheating or the formation of stringing and burrs.
2.Full-process environmental control
（1）Cleanroom production: All fine processing and subsequent treatment must be carried out in a cleanroom of at least ISO Class 7 (10,000 grade) or higher, and the number of particles in the environment must be strictly controlled.
（2）Specialized fixtures and isolation: Non-metallic specialized fixtures are used, and the equipment for processing PEEK is physically isolated from that for processing metals to completely prevent cross-contamination.
3. Process and Quality management
（1）Scientific processing parameters: By adopting a strategy of small cutting depth, rapid feed, and thorough cooling (typically using high-purity compressed air or dedicated coolant), the cutting heat can be effectively controlled, and processing stress and deformation can be suppressed.
（2）Online measurement and constant temperature detection: Electronic micrometers and pneumatic measuring instruments with a resolution of 0.001mm are frequently used in the processing. All final tests must be carried out in a constant-temperature laboratory (20±1°C) using a coordinate measuring machine (CMM) to eliminate the influence of thermal expansion and contraction on the measurement results.
（3）Strict cleaning and packaging: After processing, the parts need to undergo multiple ultrasonic cleaning, plasma cleaning and other processes, and are sealed in vacuum anti-static packaging bags in a 100-level ultra-clean workbench.
Conclusion
This PEEK part for semiconductors is the result of cutting-edge materials science and ultra-precision manufacturing processes. By deeply integrating the inherent purity and stability of PEEK with the micron-level processing technology in harsh environments, it has successfully addressed the three core demands of semiconductor manufacturing equipment for core components in terms of precision, cleanliness and reliability, becoming a key support for ensuring high yield and high efficiency operation in chip manufacturing.
